ʻO ka pauka micro silikon he meaʻawaʻawaʻole,ʻono a me ka pollution-free inorganic non-metallic material, i hanaʻia me ka quartz maoli (SiO2) a iʻole ka quartz fused (amorphous SiO2 o ka quartz maoli ma hope o ka hoʻoheheʻeʻana o ka mahana wela a me ka hoʻomahaʻana) ma o kaʻokiʻana, wili, flotation, hoʻomaʻemaʻe pickling, mālama wai maʻemaʻe kiʻekiʻe a me nā hana ʻē aʻe.He aha nā mea e hoʻohana ai i ka pauka silica?ʻO HCMilling(Guilin Hongcheng) ka mea hanamicro silikahale wili pauda.ʻO kēia ka wehewehe ʻana i ka hoʻohana ʻana i ka pauka micro silicon:

ʻO nā hiʻohiʻona o ka pauka micro silicon he: refractive index 1.54-1.55, Mohs hardness e pili ana i 7, density 2.65g/cm3, melting point 1750 ℃, dielectric mau ma kahi o 4.6 (1MHz).ʻO kāna mau hana nui:

(1) Ka hoʻopololei maikaʻi: ma muli o ka maʻemaʻe kiʻekiʻe o ka pauka silika, ka haʻahaʻa haʻahaʻa haʻahaʻa, ka hana paʻa a me ka insulation uila maikaʻi loa, ʻo ka huahana i hoʻōla ʻia he hana insulation maikaʻi a me ke kūpaʻa arc.

(2) Hiki iā ia ke hōʻemi i ka wela o ka exothermic peak o ka hoʻōla ʻana o ka epoxy resin, e hōʻemi i ka coefficient hoʻonui laina a me ka emi ʻana o ka huahana i ho'ōla ʻia, pēlā e hoʻopau ai i ke kaumaha kūloko o ka huahana i ho'ōla ʻia a pale aku i ka haki.

(3) Ka pale ʻana i ka ʻino: ʻAʻole maʻalahi ka paona micro silicon e hana me nā mea ʻē aʻe, a ʻaʻole e hoʻopili kemika me ka hapa nui o nā waikawa a me nā alkalis.Ua uhi ʻia kona mau ʻāpana ma ka ʻili o ka mea, me ke kūpaʻa ʻana i ka corrosion ikaika.

(4) He kūpono ka helu ʻana i ka nui o ka nui, hiki ke hōʻemi a hoʻopau i ka sedimentation a me ka stratification i ka wā e hoʻohana ai;Hiki iā ia ke hoʻonui i ka ikaika tensile a me ka compressive o ka huahana ho'ōla, hoʻomaikaʻi i ka pale ʻana i ka lole, hoʻonui i ka conductivity thermal o ka huahana ho'ōla, a hoʻonui i ka retardancy ahi.

(5) ʻO ka pauka silika i mālama ʻia me ka silane coupling agent he maikaʻi ka wettability i nā resins like ʻole, maikaʻi adsorption hana, maʻalahi ka hui ʻana a ʻaʻohe agglomeration.

(6) ʻO ka hoʻohui ʻana o ka pauka silica ma ke ʻano he hoʻopiha i loko o ka resin organik ʻaʻole e hoʻomaikaʻi wale i nā waiwai o ka huahana i hoʻōla ʻia, akā e hōʻemi ana hoʻi i ke kumukūʻai huahana.

Nā hoʻohana nui o ka pauka silika:

(1) Ke noi ma CCL: ʻO ka pauka micro silikon he ʻano hana hoʻopihapiha.Hiki iā ia ke hoʻomaikaʻi i ka insulation, thermal conductivity, thermal stability, acid and alkali resistance (koe wale nō ka HF), abrasion resistance a me ka lapalapa ahi o ka CCL, hoʻomaikaʻi i ka ikaika kulou a me ke kūpaʻa dimensional o ka papa, hoʻemi i ka hoʻonui wela o ka papa, a hoʻomaikaʻi i ka dielectric mau o ka CCL.I ka manawa like, hoʻohana nui ʻia ka pauka micro silicon i loko o ka ʻoihana copper clad laminate ma muli o kāna waiwai waiwai a me ke kumukūʻai haʻahaʻa, hiki ke hōʻemi i ke kumukūʻai o ka laminate copper clad.

(2) No ka hoʻohana ʻana i ka epoxy resin potting material: E like me kekahi o nā mea hoʻopiha maʻamau o ka epoxy resin potting material, ʻike maopopo ʻia ka pauka micro silicon i ka hoʻomaikaʻi ʻana i kekahi mau waiwai kino o ka resin epoxy.No ka laʻana, hiki i ka hoʻohui ʻana i ka pauka micro silicon ikaika i ka epoxy resin potting material hiki ke hoʻomaikaʻi nui i ka hopena o ka hopena o ka epoxy resin potting material a hoʻemi i ka viscosity o ka epoxy resin potting material.

(3) Ke noi i loko o ka epoxy plastic sealant: epoxy molding compound (EMC), i ʻike ʻia ʻo ka epoxy resin molding compound a me ka epoxy plastic sealant, he ʻano mea hoʻoheheʻe pauka i hui pū ʻia me ka resin epoxy e like me ka resin matrix, resin phenolic kiʻekiʻe. ka mea ho'ōla, mea hoʻopiha e like me ka silicon micro pauka, a me nā ʻano mea hoʻohui.I ka hoʻokumu ʻana o EMC, ʻo ka pauka silika ka mea hoʻopihapiha hoʻohana nui ʻia, a ʻo ke kaupaona ʻana o ka pauka silika i ka epoxy molding compound he 70% ~ 90%.

ʻO ke kaʻina hana o ka pauka micro silicon e like me nā waiwai o ka ore raw, mineralogy process mineralogy a me nā ʻano ʻē aʻe a me nā koi o nā mea hoʻohana no ka maikaʻi o ka huahana.Loaʻa ka hana ʻana i ka pauka silicon superfine kiʻekiʻe ma o ka hoʻomaʻemaʻe ʻana a i ʻole ka wili ʻana i ka hoʻomākaukau ʻana ma ke kumu o ka hoʻomākaukau ʻana i ke one maʻemaʻe kiʻekiʻe.He mea koʻikoʻi ke koho ʻana i nā lako hana, ʻoi aku ka maikaʻi o ke koho ʻana i nā mea wili superfine a me nā mea hoʻohālikelike superfine.ʻO ke koho ʻana i nā mea wili superfine a me nā mea hoʻohālikelike superfine e pili pono i ka hoʻopuka a me ka maikaʻi o nā huahana hope a me ke ʻano o nā ʻāpana pauka.ʻO HCMilling (Guilin Hongcheng), ma ke ʻano he mea hana i ka wili ʻili silicon micro powder grinding mill, ʻo kā mākou HLMX silicon micro powder vertical mill he mea pono no ka hana ʻana i ka pauka micro silicon maikaʻi loa, he nui nā pono e like me ka mana nui, kahi kikoʻī kikoʻī kiʻekiʻe. maʻiʻo haumia haʻahaʻa, etc. Ua hoʻonohonoho ʻia ka ʻōnaehana hoʻonohonoho o ka hoʻokaʻawale ʻana o ka ea lua, a ua hoʻomalu ʻia ka classifier a me ka peʻahi e ka hoʻololi pinepine ʻana i ka wikiwiki, no laila ua kiʻekiʻe ka maikaʻi o ka hoʻokaʻawale ʻana i ka pauka;Hoʻohana ʻia nā poʻo hoʻokahi a me nā poʻo he nui no ka mālama pono ʻana i ka maikaʻi o nā huahana i hoʻopau ʻia;ʻO ka maikaʻi o ka huahana i hoʻopau ʻia mai 3 μM a 22 μm.Hiki ke loaʻa nā ʻano huahana kūpono.

ʻO ka HCMmicro silikahale wili paudaua haki i ka bottleneck o nā hale wili maikaʻi ʻē aʻe e like me ka wili ea a me ka wili haʻalulu, me ka hoʻopuka ʻana i kēlā me kēia hola o 4-40t/h, a haʻahaʻa loa ka hoʻohana ʻana i ka ikehu ma mua o nā mea wili like ultra-fine.He mea aloha kaiapuni a mālama i ka ikehusilicon microhale wili pauda.Inā loaʻa iā ʻoe nā koi kūpono, e ʻoluʻolu e kelepona mai iā mākou no nā kikoʻī a hāʻawi i ka ʻike hahai iā mākou:

Ka inoa mea maka

ʻO ka maikaʻi o ka huahana (mesh/μm)

kaha (t/h)