Ifu ya micro ya Silicon ni ibintu bidafite uburozi, uburyohe kandi bidafite umwanda udafite ingufu za organic organique idafite ibyuma, bikozwe muri quartz naturel (SiO2) cyangwa quartz yahujwe (amorphous SiO2 ya quartz naturel nyuma yubushyuhe bwo hejuru gushonga no gukonjesha) binyuze mu kumenagura, gusya, flotation, gutoragura kweza, gutunganya amazi meza cyane nibindi bikorwa.Ni ubuhe buryo bukoreshwa mu ifu ya silika?HCMilling (Guilin Hongcheng) nuwakozesilicon microurusyo.Ibikurikira bisobanura ikoreshwa rya poro ya silicon:

Ibiranga ifu ya micro ya silicon ni: indangantego ya 1.54-1.55, ubukana bwa Mohs hafi 7, ubucucike bwa 2,65g / cm3, gushonga 1750 ℃, guhora dielectric hafi 4,6 (1MHz).Ibikorwa byayo byingenzi birimo:

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.Ibice byayo bitwikiriye neza hejuru yikintu, hamwe no kurwanya ruswa.

(4) Ingano yubunini buringaniye irumvikana, irashobora kugabanya no gukuraho imyanda no gutondeka mugihe ikoreshwa;Irashobora kongera imbaraga zingutu no kwikuramo ibicuruzwa byakize, kunoza imyambarire, kongera ubushyuhe bwumuriro wibicuruzwa byakize, no kongera umuriro.

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Imikoreshereze nyamukuru yifu ya silicon:

(1) Gusaba muri CCL: Ifu ya micro ya Silicon ni ubwoko bwuzuza imikorere.Irashobora kunoza insulasiyo, ubushyuhe bwumuriro, ituze ryumuriro, aside hamwe na alkali irwanya (usibye HF), kurwanya abrasion hamwe no kutagira umuriro wa CCL, kunoza imbaraga zunama hamwe nuburinganire bwikibaho, kugabanya umuvuduko wo kwagura ubushyuhe bwinama, no kunoza dielectric ihoraho ya CCL.Muri icyo gihe, ifu ya micro ya silicon ikoreshwa cyane mu nganda zometseho umuringa wa laminate bitewe n’ibikoresho fatizo bikungahaye hamwe n’igiciro gito, bishobora kugabanya igiciro cya laminate yambaye umuringa.

.Kurugero, kongeramo ifu ya silikoni ikora mubikoresho byo kubumba epoxy resin birashobora kunoza cyane ingaruka zo kurwanya ibikoresho byo kubumba epoxy resin no kugabanya ububobere bwibikoresho bya epoxy resin.

. imiti ikiza, yuzuza nka poro ya silicon, hamwe ninyongeramusaruro zitandukanye.Mubigize EMC, ifu ya silicon niyo yuzuza cyane, kandi igipimo cyibiro byifu ya silicon na epoxy molding compound ni 70% ~ 90%.

Igikorwa cyo gukora ifu ya micro ya silicon muri rusange isa nindi ukurikije imiterere yubutare bubisi, ubutare bwa minervalie nibindi biranga nibisabwa nabakoresha kugirango ubuziranenge bwibicuruzwa.Umusaruro w'ifu ya silicon nziza cyane ya silicon iboneka mugukomeza gusya cyangwa gusya mubyiciro hashingiwe kumyiteguro yumusenyi mwinshi.Guhitamo ibikoresho byo gutunganya nibyingenzi byumwihariko, cyane cyane guhitamo ibikoresho byo gusya birenze urugero.Guhitamo gusya cyane hamwe nibikoresho byo gutondekanya ibintu bizagira ingaruka ku musaruro no ku bwiza bwibicuruzwa byanyuma nuburyo imiterere yifu.HCMilling (Guilin Hongcheng), nkuruganda rukora urusyo rwa pisitori ya silicon ya silicon, uruganda rwacu rwa HLMX silicon micro powder igikoresho cyiza cyo gukora ifu ya ultra-nziza ya silicon, ifite ibyiza byinshi nkubushobozi bunini, ubuso bwihariye, ibintu bitanduye byanduye, nibindi.Umutwe umwe hamwe nifu ya poro nyinshi yibikoresho bikoreshwa mugucunga neza ibicuruzwa byarangiye;Ubwiza bwibicuruzwa byarangiye buva kuri 3 μ M kugeza kuri 22 μ m.Ibicuruzwa bitandukanye byujuje ibyangombwa birashobora kuboneka.

HCM'ssilicon microurusyoYacitse intege mu bushobozi bw’izindi nganda zidasanzwe cyane nk'uruganda rusanzwe rutembera mu kirere hamwe n’uruganda runyeganyega, hamwe n’isohoka buri saha ya 4-40t / h, hamwe n’ingufu zikoreshwa munsi cyane ugereranije n’ibikoresho bisa n’ibikoresho byo gusya cyane.Nibidukikije byangiza ibidukikije kandi bizigama ingufusilicon microurusyo.Niba ufite ibisabwa bijyanye, nyamuneka twandikire ibisobanuro birambuye hanyuma utange amakuru akurikira kuri twe:

Izina ryibikoresho

Ibicuruzwa byiza (mesh / μm)

ubushobozi (t / h)